Nvidia has secured new agreements with major South Korean firms, including SK Hynix, SK Telecom, Naver, and Doosan Group, as the U.S. chipmaker giant accelerates efforts to ensure access to essential memory chips and extend its AI reach.
The deals, unveiled during Nvidia CEO Jensen Huang’s visit to South Korea, aim to support the company’s expanding AI initiatives across data centers, robotics, and personal computing.
SK Hynix formalized a multi-year technology partnership with Nvidia, committing to develop advanced memory products intended for global AI data centers, while both companies noted that the agreement comes amid continued high demand in the memory chip sector.
Jensen Huang, speaking after discussions with SK Group Chairman Chey Tae-won, said SK Hynix would remain Nvidia’s biggest memory supplier, and the arrangement could be extended beyond its current term. He highlighted that Nvidia already sources billions of dollars’ worth of chips each year from SK Hynix, with those volumes expected to rise.
Adding to that is SK Telecom, which will also work with Nvidia to develop AI cloud infrastructure at a gigawatt scale within South Korea. Naver and Doosan Group are both also set to adopt Nvidia’s technology for their respective AI data center ventures, according to the announcements.
Doosan—specializes in both robotics and advanced materials used in Nvidia’s Blackwell chips—expects Nvidia to incorporate its energy solutions in upcoming data centers. The company further plans to adopt Nvidia’s hardware for its AI implementations.
Additionally, Nvidia is collaborating with LG Group in areas including electronics, mechanical systems, and AI-driven robotics. Discussions between Huang and LG Chairman Koo Kwang-mo also involved plans to jointly develop future data center designs, encompassing infrastructure elements such as cooling systems and power management.
Meanwhile, Huang cautions that persistent memory chip shortages could continue for several years due to widespread industry demand and supply chain constraints spanning wafers, packaging, and components essential for silicon-based technologies.
